Injection Molding solutions for Electronics

Industries
The 3C industry encompasses computers, consumer electronics, and communication devices, marked by its fast-paced innovation and stringent requirements for precision and miniaturization. Products in this sector require the integration of complex components and advanced materials to meet high consumer expectations for functionality and durability. Manufacturers face the challenge of quickly adapting to new designs and material advancements while ensuring product quality and efficiency.

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Technology to the Point

Our approach, “Technology to the point,” is designed to meet the specific needs of the 3C industry, focusing on precision, efficiency, and rapid adaptation to new trends. It enables the production of high-precision components critical for the functionality of 3C products, ensuring reliability and performance. This strategy supports manufacturers in staying ahead of the curve in a sector where innovation and quality are paramount, providing solutions that balance cost, energy consumption, and production speed.

Multi-component injection moulding

Our multi component moulding solutions enable the seamless integration of soft-touch features, functional seals and multi-material combinations for consumer electronics. Available across our range of electric and servo-hydraulic machines as a standard for many machine sizes and in many variations.

Thin wall injection moulding

Our high-speed, high-pressure injection technology enables the production of ultra-thin, lightweight electronic components with high structural integrity. Using advanced servo-electric systems, control technology that is ready for future tasks and optimised plasticising units, fast cycle times are achieved.

Liquid silicone rubber (LSR) moulding

For durable, flexible and heat-resistant electronic components, our LSR moulding solutions offer optimised metering, precise temperature control and stable injection processes. These solutions ensure high part quality with minimal material waste for keypads, protective covers, gaskets and medical-grade electronic components.

High precision

Narrow tolerances and high dimensional accuracy are essential for housings, connectors and fine mechanical parts in the electronics industry. Our machines offer servo-electric drive systems, precise clamp force distribution and high injection pressure control to ensure repeatability, structural integrity and superior surface finish. Our standardized integrated HT·XTEND smart machine features further optimze process stability and precision

Metal and Ceramic Injection Moulding (MIM/CIM)

For electronic applications requiring high-strength, heat-resistant and miniaturised metal or ceramic parts, our MIM and CIM technologies provide high-precision moulding of intricate geometries. This process is widely used for smartphone frames, wear-resistant hinges, thermal management components and high-performance structural elements.

High speed, high pressure injection systems

To meet the fast-paced demands of the 3C industry, our machines feature high injection speeds, dynamic response systems and optimised screw designs for fast cycle times and the production of ultra-thin parts. This is critical for high-volume consumer electronics and lightweighting applications.

Diverse material processing

Our machines are designed to process a wide range of high-performance materials, including reinforced plastics for increased durability and heat resistance, conductive polymers for integrated electronic components, transparent polymers for optical and display applications and bio-based and recycled materials for sustainable electronics manufacturing

Contact 3C

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